| 摘要 |
<P>PROBLEM TO BE SOLVED: To make it possible to raise a solder wettability and to ensure a reliability of soldering in mounting a semiconductor device to a lead frame with Pb-free solder. <P>SOLUTION: A partial plating 6 constituted by a noble metal is carried out on a front surface of a lead frame 2 in mounting a semiconductor device 3 to the lead frame 2 by using Pb-free solder 7. It becomes possible to raise a wettability by bonding the Pb-free solder 7 to the partial plating 6 rather than bonding the Pb-free solder 7 to the lead frame 2. As a result of this fact, carrying out the partial plating 6 makes it becomes possible to suppress poor solder wetting, a void rate increase or the like, and to raise the reliability of the soldering. <P>COPYRIGHT: (C)2009,JPO&INPIT |
