| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device having improved reliability and reduced contamination in a functional unit of an exposed device, and to provide a manufacturing method therefor. <P>SOLUTION: The electronic device 108 includes a light-receiving device 101, a frame member 102 composed of a first resin provided so as to surround a light-receiving unit 101b of the light-receiving device 101, and an encapsulating resin layer 106 composed of a second resin and filling the periphery of the frame member 102. The light-receiving unit 101b of the light-receiving device 101 is exposed, in a space surrounded by the frame member 102. The upper surface of the frame member 102 and the upper surface of the encapsulating resin layer 106 form a common plane, or the upper surface of the frame member 102 is set higher than the upper surface of the encapsulating resin layer 106. <P>COPYRIGHT: (C)2009,JPO&INPIT |
