发明名称 GROUNDING METHOD FOR PRINTED BOARD IN ELECTRONIC DEVICE, AND GROUNDING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a grounding structure capable of grounding a printed board to its body case, in a sure and stable state. SOLUTION: The grounding structure comprises a printed board 2 where electronic components are to be mounted, and a positioning hole 2b and a soldering hole 2c are made near an attaching hole 2a; a grounding metal fitting 4, where a positioning projection 4b and a soldering pin 4a to be respectively fitted to the positioning hole 2b and the soldering hole 2c of the printed board 2 are provided projected and which is fixed to the printed board 2 by a fixing implement 5 inserted to the attaching hole 2a; a soldering means for soldering the grounding pattern of the printed board 2 and the soldering pin 4a; and a fixing implement 6 for fixing the grounding metal fitting 4 to a conductive boss 3 provided projected on the structure body case 1. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009055070(A) 申请公布日期 2009.03.12
申请号 JP20080314157 申请日期 2008.12.10
申请人 PANASONIC CORP 发明人 HIRANO MASAYUKI
分类号 H05K7/14 主分类号 H05K7/14
代理机构 代理人
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