发明名称 LAPPING DEVICE AND LAPPING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a lapping device and a lapping method capable of grinding a precessed object with high accuracy. <P>SOLUTION: An adapter 12a is provided with a first support part supported by a lap base 11, a second support part mounted with the processed object 100 so that a processed surface of the processed object 100 contacts with a lapping face, and an arm part 120a extended between the first and second support parts. A height adjusting mechanism 16 changes the height from the lapping face to the first support part of the adapter 12a. An inclination detector 18 for detecting the inclination of the adapter 12a is provided in the adapter 12a. By adjusting the height of the first support part by the height adjusting mechanism 16, the inclination of the adapter 12a with respect to the lapping face is adjusted. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009050992(A) 申请公布日期 2009.03.12
申请号 JP20070222742 申请日期 2007.08.29
申请人 FUJITSU LTD 发明人 SUDO KOJI;YANAGIDA YOSHIAKI;NISHIOKA TERUAKI
分类号 B24B37/04;B24B1/00;B24B37/10;B24B49/10;G11B5/31;G11B5/39 主分类号 B24B37/04
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