发明名称 |
PATTERN FORMING METHOD AND MATERIAL FOR FORMING COATING FILM |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new pattern forming method in which the number of steps in a double patterning method can be reduced and to provide a material for forming a coating film suitably used for the pattern forming method. <P>SOLUTION: The method comprises: applying a first chemically amplified resist composition on a support body 1 to form a first resist film 2; selectively exposing and developing the first resist film 2 to form a plurality of first resist patterns 3; forming a coating film 4 on the surface of each first resist pattern 3 by using a material for forming a coating film containing a polymer containing an oxazoline group to form a plurality of coating patterns 5; applying a second chemically amplified resist composition on the support body 1 where the coating patterns 5 are formed so as to form a second resist film 6; and selectively exposing and developing the second resist film 6 to form a pattern comprising the plurality of coating patterns 5 and a second resist pattern 7 formed in the second resist film 6 on the support body 1. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009053546(A) |
申请公布日期 |
2009.03.12 |
申请号 |
JP20070221624 |
申请日期 |
2007.08.28 |
申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
ISHIKAWA KIYOSHI;SAWANO ATSUSHI;WAKIYA KAZUMASA |
分类号 |
G03F7/38;G03F7/11;G03F7/26;G03F7/40;H01L21/027 |
主分类号 |
G03F7/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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