发明名称 PATTERN FORMING METHOD AND MATERIAL FOR FORMING COATING FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a new pattern forming method in which the number of steps in a double patterning method can be reduced and to provide a material for forming a coating film suitably used for the pattern forming method. <P>SOLUTION: The method comprises: applying a first chemically amplified resist composition on a support body 1 to form a first resist film 2; selectively exposing and developing the first resist film 2 to form a plurality of first resist patterns 3; forming a coating film 4 on the surface of each first resist pattern 3 by using a material for forming a coating film containing a polymer containing an oxazoline group to form a plurality of coating patterns 5; applying a second chemically amplified resist composition on the support body 1 where the coating patterns 5 are formed so as to form a second resist film 6; and selectively exposing and developing the second resist film 6 to form a pattern comprising the plurality of coating patterns 5 and a second resist pattern 7 formed in the second resist film 6 on the support body 1. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009053546(A) 申请公布日期 2009.03.12
申请号 JP20070221624 申请日期 2007.08.28
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ISHIKAWA KIYOSHI;SAWANO ATSUSHI;WAKIYA KAZUMASA
分类号 G03F7/38;G03F7/11;G03F7/26;G03F7/40;H01L21/027 主分类号 G03F7/38
代理机构 代理人
主权项
地址