| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card having high peeling strength and a flat surface by preventing filling defects of adhesives for forming an adhesive layer in the manufacture of the IC card provided with the adhesive layer coating a module and a pair of base materials holding the module between the adhesive layers through the adhesive layer, and to provide a manufacturing method of the IC card. <P>SOLUTION: The IC card 10 is provided with an insulating base material 17, a module 11 having portions 18A, 18B composed of components formed on the insulating base material 17 and constituted so as to mutually separate these portions 18A, 18B, an adhesive layer 12 for coating the module 11, and a first base material 13 and a second base material 14 which hold the module 11 between them through the adhesive layer 12. The module 11 has a hole 19 formed between the portions 18A, 18B of the module 11 along mutually opposed sides and penetrating through the insulating base material 17 and the adhesive layer 12 is formed in the hole 19. <P>COPYRIGHT: (C)2009,JPO&INPIT |
