| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device which integrally forms a part of a package and a piezoelectric vibrating reed without using a conductive bond, and hermetically seals it by a lid with high temperature solder applied. SOLUTION: A piezoelectric device (100) has a lid (20) on which a high temperature solder layer (21) is formed on one side, a first electrode pattern (31) formed on a first surface and a second electrode pattern (33) formed on a second surface, a piezoelectric vibrating reed (60) on which a first conductive path (91) through which a high temperature solder of a high temperature solder layer flows from the first electrode pattern to the second surface, and a base (70) having a second conductive path (71) through which the high temperature solder from the first conductive path further flows downward and which is conductive with a first external electrode. COPYRIGHT: (C)2009,JPO&INPIT
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