| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a through-wiring structure with which superior reliability and stability of electrical connections among wafers can be obtained. <P>SOLUTION: The through-wiring structure is such that one of opposed electrical signal connecting portions 92 and 26 is a through-wiring portion 92 that electrically connects one surface and the other surface of a wafer; the through-wiring portion 92 has a through-projection portion 92a projecting from a stuck surface 30a; the through-projection portion 92a has a wiring sidewall pair 92b which are disposed opposite each other to extend from a sticking surface 30a to other wafers; the other opposed electrical signal connecting portions 92 and 26 is a bump 26; an end portion 92c of the through-wiring portion 92 bites into the bump 26; and the bump 26 is pinched in between the wiring sidewall pair 92b. <P>COPYRIGHT: (C)2009,JPO&INPIT |
