| 摘要 |
PROBLEM TO BE SOLVED: To reduce variation of characteristic impedance depending on a location, in a printed wiring board provided with a ground layer and a power layer. SOLUTION: Signal lines 13 each having a predetermined wiring pattern are arranged on one-side surface of an insulation layer 11 through an adhesive layer 12. An electrode surface 15 forming a ground layer or a power supply layer is formed on the other-side surface of the insulation layer 11 through an adhesive layer 14. The signal lines 13 are covered with a coating layer 16, and the electrode surface 15 is covered with a coating layer 17. Linear openings 18 having a pattern equal to the wiring pattern are formed on the electrode surface 15. The linear openings 18 are arranged along the corresponding signal lines. COPYRIGHT: (C)2009,JPO&INPIT
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