| 摘要 |
The present invention relates to a pressure-sensitive adhesive sheet for dicing comprising a substrate layer and an active energy ray-curable pressure-sensitive adhesive layer provided on the substrate layer, in which the active energy ray-curable pressure-sensitive adhesive layer has a gel fraction before irradiation with an active energy ray of 50% or more. Furthermore, the invention also provides a method for dicing an adherend, which comprises attaching the pressure-sensitive adhesive sheet for dicing to an adherend, followed by cutting the adherend using a round blade. The pressure-sensitive adhesive sheet for dicing of the invention is free from leaving any adhesive residue on chips, from peeling of the pressure-sensitive adhesive sheet from the ring for fixing it, as well as from leaving any paste residue on the ring.
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