发明名称 |
Electronic Package Device, Module, and Electronic Apparatus |
摘要 |
There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate 3 and a semiconductor device 1 and an insertion substrate 18 which are arranged on the substrate 3. The interposer substrate 3 includes a wiring pattern 6 therein. A gap 8 is formed between the semiconductor device 1 and the insertion substrate 18; in an area corresponding to the gap, a reinforcing member (a metallic film 7) is formed to increase strength of the wiring pattern 6.
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申请公布号 |
US2009065921(A1) |
申请公布日期 |
2009.03.12 |
申请号 |
US20070223963 |
申请日期 |
2007.02.28 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
YAMAZAKI TAKAO;SOGAWA YOSHIMICHI;SHIRONOUCHI TOSHIAKI;OHYACHI KENJI |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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