发明名称 ADHESIVE-COATED BACKING FOR FLEXIBLE CIRCUIT
摘要 <p>The invention relates to adhesive coated backings used during fabrication of flexible circuits. The adhesive coatings exhibit high initial adhesion and a reduced level of 5 adhesion after exposure to suitable radiation.</p>
申请公布号 WO2009032482(A2) 申请公布日期 2009.03.12
申请号 WO2008US72796 申请日期 2008.08.11
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 YANG, RUI,;XIA, JIANHUI,;SHIRCK, JAMES, R.
分类号 C23C18/00 主分类号 C23C18/00
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