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发明名称
ADHESIVE-COATED BACKING FOR FLEXIBLE CIRCUIT
摘要
<p>The invention relates to adhesive coated backings used during fabrication of flexible circuits. The adhesive coatings exhibit high initial adhesion and a reduced level of 5 adhesion after exposure to suitable radiation.</p>
申请公布号
WO2009032482(A2)
申请公布日期
2009.03.12
申请号
WO2008US72796
申请日期
2008.08.11
申请人
3M INNOVATIVE PROPERTIES COMPANY
发明人
YANG, RUI,;XIA, JIANHUI,;SHIRCK, JAMES, R.
分类号
C23C18/00
主分类号
C23C18/00
代理机构
代理人
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