METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENTS

摘要

A method for manufacturing a printed circuit board having embedded electronic components is provided to remove a via forming process for connecting a fist and a second substrate by forming a conductive bump on the first substrate. A method for manufacturing a printed circuit board is comprised of the steps: forming a conductive bump on a first substrate through a screen print(S100); laminating an insulating member on the first substrate(S200); laminating a second substrate having a cavity corresponding to the device mounting unit on the fist substrate(S300); mounting the electric component is mounted on the device mounting unit through the cavity(S400); and filing the cavity with a filler(S500).