RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF

摘要

A rigid-flexible printed circuit board and a method for manufacturing thereof is provided to form an insulating layer on a flexible substrate so there is no need to form a copper layer on the substrate. A rigid-flexible printed circuit board includes a flexible substrate(110), a bonding sheet(120), an insulating layer(130'), a second circuit pattern(140') and a via(150). A flexible substrate includes a flexible region and a rigid region. A first circuit pattern(112) is formed on the flexible substrate, and the bonding sheet is formed at one side of rigid region. The insulating layer is formed at the one side of the bonding sheet, and the insulating layer covers the flexible substrate. A second circuit pattern is formed at one side of the insulating layer. The via is formed the insulating layer and the bonding sheet.