| 摘要 |
This invention provides an electrolytic copper foil, which has a low profile surface equivalent to conventional low-profile electrolytic copper foil and has very large mechanical strength, and a method for manufacturing the same. In the electrolytic copper foil, the precipitated crystal particles of copper are fine, and the particle diameter has a small variation unattainable by the prior art technique. More specifically, the electrolytic copper foil has a low-profile and glossy surface, has a very large mechanical strength of 70 kgf/mm2 to 100 kgf/mm2 in terms of normal-state tensile strength value and, even after heating (180°C x 60 min), has a tensile strength value of not less than 85% of normal-state tensile strength value. The electrolytic copper foil is manufactured by an electrolytic method using a sulfuric acid-type copper electrolysis solution containing a compound having a structure comprising a sulfone group attached to the benzene ring, a sulfonic acid salt of an active sulfur compound, and a quaternary ammonium salt polymer having a cyclic structure. As shown in the drawing, this elctrolytic copper foil is suitable for the manufacture of TAB having a flying lead. |
