发明名称 |
SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER |
摘要 |
A semiconductor device package, for example a flip-chip package, having a solder bump mounted above a polymer layer for use in flip-chip mounting of a semiconductor device to a circuit board. A polymer layer such as polybenzoxazole is formed overlying a wafer passivation layer. Solder bumps are attached to an under-bump metallization layer and electrically coupled to conductive bond pads exposed by openings in the wafer passivation layer. |
申请公布号 |
EP1815515(A4) |
申请公布日期 |
2009.03.11 |
申请号 |
EP20050824732 |
申请日期 |
2005.10.28 |
申请人 |
FLIPCHIP INTERNATIONAL L.L.C. |
发明人 |
VRTIS, JOAN K.;CURTIS, ANTHONY;TRIMMER, BRET;KING, BRIAN;LU, HENRY, Y.;BALKAN, HALUK |
分类号 |
H01L23/48;H01L21/44;H01L21/48;H01L21/50;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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