| 摘要 |
A non cyanide gold plating bath for forming a bump is provided to control bump hardness in a range of 30~60 HV by selecting the addition amount of polyalkylene glycol and to obtain a bump made of an electrolytic gold plating film, with even surface. A non cyanide gold plating bath for forming a bump comprises alkali gold sulfites or ammonium gold sulfites as a gold source; water-soluble amine as a stabilizer for the plating bath; a crystallization control agent; conductive salt 5~150 g/L consisting of sodium sulfite; a buffer agent; and polyalkyleneglycol 0.01~10 mg/L of the molecular weight 2000~6000. |
