发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To realize a surface mounted electronic component for making it unnecessary to provide any exterior body made of resin or bending-worked(forming-worked) lead terminal. <P>SOLUTION: This surface mounted electronic component 10 is provided with a silicon diode 16 formed with a bottom electrode 12 and upper electrode 14 and an almost cap-shaped electrode member 18 having a top plate 22, a side plate 24 extended downward at a predetermined angle from the peripheral edge of the top plate 22, and a flange 26 extended from the peripheral edge of the side plate 24 to almost a horizontal direction for covering the silicon diode 16. In this case, an internal face 22a of the top plate 22 of the electrode member 18 is connected to an external face 14a of the upper electrode 14 of the silicon diode 16, and an internal face 26a of the flange 26 of the electrode member 18 and an external face 12a of the bottom electrode 12 of the silicon diode 16 are formed as an almost flat-topped and plane face. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP4235417(B2) 申请公布日期 2009.03.11
申请号 JP20020253308 申请日期 2002.08.30
申请人 发明人
分类号 H01L23/02;H01L23/48;H01L23/04;H01L23/06 主分类号 H01L23/02
代理机构 代理人
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