| 摘要 |
<p>A method for manufacturing a substrate module (M1, M2) that has three-dimensional structures formed on a surface thereof, includes forming a color layer (4a) on a top surface of a substrate layer (1a); forming a first 3D structure layer (3a') on a bottom surface of the substrate layer (1a) via a first transparent tooling (2a); and curing the first 3D structure layer (3a') via lights (L1) passing through the first transparent tooling (2a) in order to harden the first 3D structure layer (3a'). Moreover, the method further includes forming a second 3D structure layer (3b') on a top surface of the color layer (4a) via a second transparent tooling (2b); and curing the second 3D structure layer (3b') via lights (L2) passing through the second transparent tooling (2b) in order to harden the second 3D structure layer (3b'). Hence, the first 3D structure layer (3a') and the second 3D structure layer (3b') are formed on the bottom surface and the top surface of the substrate module (M2), respectively.</p> |
