| 摘要 |
A connection for a semiconductor component test apparatus is provided to give elasticity to a signal electrode and a ground electrode through one bending process by forming a signal extension part and a ground extension part in the signal electrode and the ground electrode. At least two electrode pieces(123) are regularly separated from the bottom of the signal electrode to connect the bottom of the signal electrode. A signal electrode includes a signal extension part vertical to the bottom from the center. The signal electrode is slantingly curve-cut to a semicircular core shield(130) in the signal extension part. The ground electrode includes the ground extension part vertical to the bottom from the center. The ground electrode is curve-cut in parallel to the signal electrode in the bottom of the ground extension part.
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