发明名称 Doping method and manufacturing method for a semiconductor device
摘要 A doping method includes implanting first impurity ions into a semiconductor substrate, so as to form a damaged region in the vicinity of a surface of the semiconductor substrate, the first impurity ions not contributing to electric conductivity; implanting second impurity ions into the semiconductor substrate through the damaged region, the second impurity ions having an atomic weight larger than the first impurity ions and contributing to the electric conductivity; and heating the surface of the semiconductor substrate with a light having a pulse width of about 0.1 ms to about 100 ms, so as to activate the second impurity ions.
申请公布号 US7501332(B2) 申请公布日期 2009.03.10
申请号 US20050097259 申请日期 2005.04.04
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ITO TAKAYUKI;SUGURO KYOICHI
分类号 H01L21/425;H01L21/336;H01L21/8238 主分类号 H01L21/425
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