| 摘要 |
<p>Ceramic cover wafers of aluminum nitride or beryllium oxide are provided to increase the wafer yield and reduce the washing time by loading the ceramic cover substrate. An aluminum-nitride ceramic cover substrate(40) is made of the aluminum-nitride ceramics. The aluminum-nitride ceramics has the thermal conductance higher than 160 W/m-K. The base plate is made as the circular geometry. The diameter of the base plate is about 11 ~ 13 inches. The thickness of the base plate is 0.030~0.060. The planarity of the base plate is about 0.010 inch or less.</p> |
