发明名称 |
System and method for photolithography in semiconductor manufacturing |
摘要 |
A method for producing a pattern on a substrate includes providing at least one exposure of the pattern onto a layer of the substrate by a higher-precision lithography mechanism and providing at least one exposure of the pattern onto a layer of the substrate by a lower-precision lithography mechanism. The exposures can be done in either order, and additional exposures can be included. The higher-precision lithography mechanism can be immersion lithography and the lower-precision lithography mechanism can be dry lithography.
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申请公布号 |
US7501227(B2) |
申请公布日期 |
2009.03.10 |
申请号 |
US20050216658 |
申请日期 |
2005.08.31 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY |
发明人 |
CHEN KUEI SHUN;LIN CHIN-HSIANG;LU DAVID DING-CHUNG |
分类号 |
G03F7/20 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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