发明名称 Resist composition
摘要 A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.
申请公布号 US7501220(B2) 申请公布日期 2009.03.10
申请号 US20040845620 申请日期 2004.05.13
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 HIRAYAMA TAKU;HADA HIDEO;FUJIMURA SATOSHI;IWAI TAKESHI;SATO MITSURU;TAKASU RYOICHI;TACHIKAWA TOSHIKAZU;IWASHITA JUN;ISHIDUKA KEITA;YAMADA TOMOTAKA;TAKAYAMA TOSHIKAZU;YOSHIDA MASAAKI
分类号 G03F7/00;G03C1/76;G03F7/004;G03F7/038;G03F7/039;G03F7/20;G03F7/26;H01L21/027 主分类号 G03F7/00
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