发明名称 |
Thin printed circuit board for manufacturing chip scale package |
摘要 |
Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is comprised of a circuit pattern, to which a semiconductor chip is adhered, and a substrate surrounding the circuit pattern. The unit printed boards are arranged in a row and includes a support molding, which is spaced a predetermined interval apart from the circuit pattern of each unit printed circuit board on the substrate of each unit printed circuit board and formed in a ring shape along the edge of the thin printed circuit board.
|
申请公布号 |
US7502231(B2) |
申请公布日期 |
2009.03.10 |
申请号 |
US20070950971 |
申请日期 |
2007.12.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG YI-SUNG;JIN HO-TAE;JANG HWAN-YOUNG |
分类号 |
H01L23/12;H05K7/00;H01L23/13;H05K1/02;H05K3/00 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|