发明名称 High density semiconductor memory
摘要 A memory cell, array and device include cross-shaped active areas and polysilicon gate areas disposed over arm portions of adjacent cross-shaped active areas. The polysilicon gate areas couple word lines with capacitors associated with each arm portion of the cross-shaped active areas. Buried digit lines are coupled to body portions of the cross-shaped active areas. The word lines and digit lines provide a unique contact to each capacitor of the array of memory cells. Each memory cell has an area of 5F2. An electronic system and method for fabricating a memory cell are also disclosed.
申请公布号 US7501676(B2) 申请公布日期 2009.03.10
申请号 US20050089890 申请日期 2005.03.25
申请人 MICRON TECHNOLOGY, INC. 发明人 DOYLE DANIEL H.
分类号 H01L27/108;H01L29/94 主分类号 H01L27/108
代理机构 代理人
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