发明名称 Activated chemical process for enhancing material properties of dielectric films
摘要 A method for restoring a dielectric constant of a layer of a silicon-containing dielectric material having a first dielectric constant and at least one surface, wherein the first dielectric constant of the layer of silicon-containing dielectric material has increased to a second dielectric constant, the method comprising the steps of: contacting the at least one surface of the layer of silicon-containing dielectric material with a silicon-containing fluid; and exposing the at least one surface of the layer of silicon-containing dielectric material to an energy source selected from the group consisting of: UV radiation, heat, and an electron beam, wherein the layer of silicon-containing dielectric material has a third dielectric constant that is lower than the second dielectric constant after exposing the layer of silicon-containing dielectric material to the energy source.
申请公布号 US7500397(B2) 申请公布日期 2009.03.10
申请号 US20080023552 申请日期 2008.01.31
申请人 AIR PRODUCTS AND CHEMICALS, INC. 发明人 WEIGEL SCOTT JEFFREY;O'NEILL MARK LEONARD;VRTIS RAYMOND NICHOLAS;SINATORE DINO
分类号 H01L21/311 主分类号 H01L21/311
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