| 摘要 |
<p>A method for manufacturing a light emitting device and a lead frame structure are provided to improve light emitting efficiency of the LED(Light Emitting Device) by preventing scratches from being formed on a surface of a lens. A lead frame includes a heat metal(27), a lead electrode(21), a body(28), and at least one through-hole. A protrusion portion is formed on an upper surface of the heat metal, such that heat from a diode chip is radiated. The body fixes the heat metal and the lead electrode. The through-hole is formed around the heat metal. The through-hole is formed on the body. The through-hole includes a guiding portion, which is bigger than a radius of the through-hole at a predetermined height from a rear surface of the lead frame.</p> |
