| 摘要 |
A heat-curable polyimide silicone resin composition is provided to form a cured coating film with heat resistance, mechanical strength, and adhesion to various substrates by thermal process at low temperature for the short time. A heat-curable polyimide silicone resin composition comprises (a) polyimide silicone resin 100 part by mass having a radically polymerizable group bonded with a silicon atom, (b) a peroxycarbonate hardener 0.1~20 part by mass, and (c) solvent. The polyimide silicone resin includes two repeat units represented by the chemical formula 1, and has the average molecular weight(polystyrene conversion) of 5,000~150,000.
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