| 摘要 |
High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same are disclosed. Presented HFIC assembly method has the optimized structure for minimizing the losses in transmitting electronic and electromagnetic energy in interconnects; it optimizes the area used for interconnects and eliminates most hazardous materials from the assembly process making it an environmentally friendly alternative for IC assembly purposes. This versatile assembly process was developed specifically for HFIC packaging, but its versatility expands its usage from monolithic microwave integrated circuit (MMIC) packaging to partial PCB assemblies and due to environmental friendliness potentially replacing other PCB techniques especially in high performance applications. HFIC assembly comprises a first substrate (702, 703) and a second substrate (701) of conductor-on-insulator or similar having high aspect ratio trenches and conductors (705, 706, 707, 708) as well as a chip therebetween. A common ground (707, 708, 710, 710', 711, 711') formed by the first and second substrates encompass the chip at least adjacent the HF-signal paths (706).
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