发明名称 |
Methods and apparatus for reducing arcing during plasma processing |
摘要 |
In a first aspect, a method is provided for use during plasma processing. The first method includes the steps of (1) placing a substrate on a substrate holder of a plasma chamber; (2) positioning a cover frame adjacent and below a perimeter of the substrate; and (3) employing the cover frame to reduce arcing during plasma processing within the plasma chamber. Numerous other aspects are provided.
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申请公布号 |
US7501161(B2) |
申请公布日期 |
2009.03.10 |
申请号 |
US20040858267 |
申请日期 |
2004.06.01 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HOU LI;WANG QUNHUA;SUM EDWIN;WHITE JOHN M. |
分类号 |
C23C16/505;H05H1/24;C23C16/00;C23C16/458;C23C16/50;H01J37/32;H01L21/00;H01L21/205 |
主分类号 |
C23C16/505 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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