| 摘要 |
A wafer carrying apparatus or cassette is disclosed, which includes a binding or retention unit, so as to prevent wafers from being damaged by crash, inadvertent egress or exiting, and so on. The wafer carrying apparatus includes a main body provided with a plurality of wafer insertion grooves formed on inner sides and an opening formed on a front surface to take wafers in and out, a binding unit configured to move up and down on the front surface of the main body, its position relative to the insertion grooves being variable so as to close and open the insertion grooves, and a mechanism for varying the position of the binding unit relative to the insertion grooves, the mechanism being connected to the binding unit.
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