| 摘要 |
A wafer bonding module and a method thereof are provided to prevent twist of two wafers and crack on wafers to be bonded. A wafer bonding module comprises a substrate supporting stand(110), a spacer(120), an aligning supporter(130), and a pusher(140), and includes a transferring unit and a control unit. The spacer and the aligning supporter supports two wafers(10, 20). After removing the spacer, the aligning supporter is removed. A generation of scratch on the wafers is prevented in bonding two wafers.
|
