发明名称 HEAT SPREADER COOLER FOR ELECTRONIC DEVICE
摘要 A heat spreader cooler for an electronic device is provided to prevent an internal wick from being deformed although it is horizontally or vertically installed or installed in the bent state, thereby making the flow of refrigerant smoothly. The refrigerant exists in a casing(5), and the inside of the casing is in the vacuum state. A plurality of wicks(10a,10b) are built along the longitudinal direction of the casing within the casing. A pressure withstanding spacer(20) is arranged between the wicks and is formed in a size corresponding to that of the wicks. A flat type metal plate is inserted into a pin-fin mold and pressed so that protrusions of the pin-fin can be formed at the upper and lower parts thereof. The metal plate is made of the copper or aluminium material.
申请公布号 KR20090024421(A) 申请公布日期 2009.03.09
申请号 KR20070089433 申请日期 2007.09.04
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 KWON, OH KYUNG;YUN, JAE HO;CHA, DONG AHN
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
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