| 摘要 |
A saw wire is provided to deal with a thickness deviation of a wafer due to the reduction of the diameter and supply defect of an abrasive by limiting the longitudinal residual stress to 400~1000MPa in the region of 5~10micro meter depth from the surface. In a saw wire for cutting hard material like a silicon block, diameter(D0) of the saw wire ranges from 0.08~0.03mmPhi. The longitudinal residual stress of the saw wire ranges from 400~1000MPa in the region of the depth of 5~10micron meters apart from the surface.
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