METHOD FOR MANUFACTURE PROBE CARD

摘要

A method for manufacturing the probe card is provided to detect easily the defective by bonding two substrates and space transformer after forming the respective probe beam, the probe tip and conduction bump. The probe beam(140) and probe tip(150) are formed in the first sacrificial substrate(100). The through-hole is formed by etching the conduction bump reserved area defined in the second sacrificial substrate. The first sacrificial substrate is bonded with the second sacrificial substrate. The conduction bump connected to the probe beam is formed to bury the conduction bump reserved area. The conduction bump is bonded with the space transformer.