发明名称 |
COOLING SYSTEM FOR A COMPUTER BY USING A THERMOELECTRIC MODULE |
摘要 |
A computer cooling device using a thermoelectric module is provided to solve the partial generation of heat from computer parts by using the thermoelectric module, thereby reducing the whole temperature inside a computer. A low temperature part(10) has a heat sink(12) for cooling and a cooling fan(14). The heat sink is mounted inside a computer case. The cooling fan provides circular air. A high temperature part(30) has a heat sink(32) for radiating heat and a heat-radiating fan(34). The heat sink is mounted outside the computer case. The heat-radiating fan provides circular air. A thermoelectric module(20) is mounted between the heat sinks to absorb the heat from the cooling heat sink and discharge the heat to the heat sink for heat-radiating. A duct part(40) transfers cooling air to a CPU, GPU and power supply device from the cooling heat sink and supplies the cooling air into the computer.
|
申请公布号 |
KR20090024413(A) |
申请公布日期 |
2009.03.09 |
申请号 |
KR20070089419 |
申请日期 |
2007.09.04 |
申请人 |
KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY |
发明人 |
KWON, OH KYUNG;YUN, JAE HO;CHA, DONG AHN |
分类号 |
G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|