发明名称 COOLING SYSTEM FOR A COMPUTER BY USING A THERMOELECTRIC MODULE
摘要 A computer cooling device using a thermoelectric module is provided to solve the partial generation of heat from computer parts by using the thermoelectric module, thereby reducing the whole temperature inside a computer. A low temperature part(10) has a heat sink(12) for cooling and a cooling fan(14). The heat sink is mounted inside a computer case. The cooling fan provides circular air. A high temperature part(30) has a heat sink(32) for radiating heat and a heat-radiating fan(34). The heat sink is mounted outside the computer case. The heat-radiating fan provides circular air. A thermoelectric module(20) is mounted between the heat sinks to absorb the heat from the cooling heat sink and discharge the heat to the heat sink for heat-radiating. A duct part(40) transfers cooling air to a CPU, GPU and power supply device from the cooling heat sink and supplies the cooling air into the computer.
申请公布号 KR20090024413(A) 申请公布日期 2009.03.09
申请号 KR20070089419 申请日期 2007.09.04
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 KWON, OH KYUNG;YUN, JAE HO;CHA, DONG AHN
分类号 G06F1/20 主分类号 G06F1/20
代理机构 代理人
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