发明名称 Multilayer printed circuit board and manufacturing method thereof
摘要 A printed circuit board includes a product portion and a backing plate. Upper and lower surfaces of the backing plate are coated with solder masks with different material characteristics.
申请公布号 US7498522(B2) 申请公布日期 2009.03.03
申请号 US20060507478 申请日期 2006.08.22
申请人 FUJITSU LIMITED 发明人 ITOH NOBUTAKA
分类号 H05K1/03 主分类号 H05K1/03
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