发明名称 Method for packaging organic light emitting display with frit seal and reinforcing structure
摘要 Disclosed is a method for packaging an organic light emitting display having a reinforcing member formed between a first substrate and a second substrate by dipping non-pixel regions of unit display panels in a liquid curable material. Organic light emitting pixel arrays are formed at a plurality of pixel regions of a first mother substrate. A frit is formed at a position of the second mother substrate corresponding to non-pixel regions of the first mother substrate. The first and second mother substrates are coalesced to each other and sealed by the frit. The mother substrates are cut into unit display panels. The unit display panels are aligned. Non-pixel regions of the unit display panels are dipped in the liquid curable material and the material is cured to form the reinforcing member.
申请公布号 US7498186(B2) 申请公布日期 2009.03.03
申请号 US20060529910 申请日期 2006.09.29
申请人 SAMSUNG SDI CO., LTD. 发明人 LEE JAE SUN
分类号 H01L21/56;H01L21/78 主分类号 H01L21/56
代理机构 代理人
主权项
地址