发明名称 |
Package with barrier wall and method for manufacturing the same |
摘要 |
A ball grid array (BGA) package that may suppress flash contamination may include a flash contamination barrier wall. The barrier wall may be a portion of a copper pattern provided on a substrate. During a molding process, the flash contamination barrier may prevent a flash from contaminating a ball land. The barrier wall may restrict the flash to flow through a concave portion that may be defined by a surface of the substrate.
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申请公布号 |
US7498193(B2) |
申请公布日期 |
2009.03.03 |
申请号 |
US20060606277 |
申请日期 |
2006.11.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWAK MIN-KEUN;KIM IL-KI |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L21/56;H01L23/31;H01L23/498;H05K1/11;H05K3/28;H05K3/34 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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