发明名称 Light-emitting semiconductor device of improved efficiency
摘要 An LED comprises a semiconductor region including an active layer for generating light. An anode is arranged centrally on one of the opposite major surfaces of the semiconductor region from which is emitted the light. A reflective metal layer is bonded to the other major surface of the light-generating semiconductor region via an ohmic contact layer. Sufficiently thin to permit the passage of light therethrough, the ohmic contact layer is formed in an open-worked pattern to leave exposed part of the second major surface of the semiconductor region. A transparent, open-worked anti-alloying layer is interposed between the light-generating semiconductor region and the reflective metal layer, covering that part of the second major surface of the light-generating semiconductor region which is left exposed by the ohmic contact layer. The anti-alloying layer prevents the light-generating semiconductor region and reflective metal layer from alloying during heat treatments conducted in the curse of LED manufacture. A greater percentage of the light from the light-generating semiconductor region is reflected by the reflective metal layer for emission from the first major surface of the light-generating semiconductor region than in the absence of the anti-alloying layer.
申请公布号 US7498609(B2) 申请公布日期 2009.03.03
申请号 US20050222369 申请日期 2005.09.08
申请人 SANKEN ELECTRIC CO., LTD. 发明人 MUROFUSHI HITOSHI;AOYAGI HIDEKAZU;TAKEDA SHIRO;UCHIDA YOSHIHIKO
分类号 H01L27/15;H01L33/04;H01L33/10;H01L33/30;H01L33/38;H01L33/42 主分类号 H01L27/15
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