发明名称 Process condition measuring device and method for measuring shear force on a surface of a substrate that undergoes a polishing or planarization process
摘要 At least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.
申请公布号 US7497134(B2) 申请公布日期 2009.03.03
申请号 US20070861207 申请日期 2007.09.25
申请人 KLA-TENCOR CORPORATION 发明人 RENKEN WAYNE G.;SUN MEI H.;MASON ARON ABRAMOWSKI
分类号 G01L1/16 主分类号 G01L1/16
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