| 摘要 |
Polyamide molding compounds, comprise: (A) at least a co-polyamide of decamethylene terephthalamide/hexamethylene terephthalamide (30-100 wt.%), which is made up of (A1) decamethylene terephthalamide units (40-95 mol.%) derived from monomers of 1,10-decanediamine and (A2) terephthalic acid and hexamethylene terephthalamide units (5-60 mol.%) derived from monomers of 1,6-hexane diamine and terephthalic acid; (B) a strengthener and/or filler (0-70 wt.%); and (C) an additive and/or further polymer (0-50 wt.%). Polyamide molding compounds, comprise: (A) at least a co-polyamide of decamethylene terephthalamide/hexamethylene terephthalamide (30-100 wt.%), which is made up of (A1) decamethylene terephthalamide units (40-95 mol.%) derived from monomers of 1,10-decanediamine and (A2) terephthalic acid and hexamethylene terephthalamide units (5-60 mol.%) derived from monomers of 1,6-hexane diamine and terephthalic acid; (B) a strengthener and/or filler (0-70 wt.%); and (C) an additive and/or fu rther polymer (0-50 wt.%), where the amount of all components from (A) to (C) gives 100% with the condition that in (A1) and/or (A2), up to 30 mol.%, related to the total amount of the dicarboxylic acid, of the terephthalic acid can be replaced by other aromatic, aliphatic or cycloaliphatic dicarboxylic acid with 6-36 carbon atoms; and with the condition that in (A1) and/or (A2), up to 30 mol.% of 1,10-decanediamine and 1,6-hexanediamine respectively, related to the total amount of the diamine, can be replaced by other diamine with 4-36 carbon atoms; and with the condition that not more than 30 mol.% of the compounds in the component (A), related to the total amount of the monomers, is formed from lactam or amino acid; and with the condition that the sum of the monomers, which replaces terephthalic acid, 1,6-hexanediamine and 1,10-decanediamine, not exceeds a concentration of 30 mol.%, related to the total amount of the monomers used in component (A). Independent claims are included f or: (1) a polyamide mixture comprising polyamide-molding compounds, or comprising polyamide-molding compounds and polyphenylene ether, preferably in the form of homopolymers, copolymers, graft copolymers, block copolymers or ionomers, preferably poly(2,6-diethyl-1,4-phenyle ne)ether, poly(2-methyl-6-ethyl-1,4-phenylene)ether, poly(2-methyl-6-propyl-1,4-phenylene)ether, poly(2,6-dipropyl-1,4-phe nyle)ether, poly(2-ethyl-6-propyl-1,4-phenylene)ether and/or copolymers, like 2,3,6-trimethylphenol, where preferably the mixture contains 10-45 wt.% of polyphenylene ether and optionally up to 30 wt.%, preferably up to 15 wt.% of impact resistance modifier; (2) a granulate, preferably long fiber reinforced small rod granulate, semi-finished product or molded body from the polyamide molding compounds or from the polyamide mixture, preferably for use in moist and/or wet environment; (3) a powder from the polyamide molding compounds or from the polyamide mixture, preferably with a grain size of 2 0-200 mu m; and (4) producing the polyamide molding compounds, comprising adding a poly-condensation catalyst to the monomer mixture during the production of the component (A), where the catalyst is phosphorous compound, like phosphoric acid, phosphorous acid, hypo-phosphorous acid, phenyl phosphonic acid and/or their salts, with 1-3 cations, like sodium, potassium, magnesium, gallium, zinc or aluminum and/or their esters, like triphenyl phosphate, triphenyl phosphite and/or tris(hydroxymethyl)aminomethane-(nonylphenyl)-phosphite. . |
