发明名称 METHOD OF POLISHING A TUNGSTEN-CONTAINING SUBSTRATE
摘要 THE INVENTION PROVIDES A METHOD OF CHEMICALLY-MECHANICALLY POLISHING A SUBSTRATE COMPRISING TUNGSTEN THROUGH USE OF A COMPOSITION COMPRISING A TUNGSTEN ETCHANT, AN INHIBITOR OF TUNGSTEN ETCHING, AND WATER, WHEREIN THE INHIBITOR OF TUNGSTEN POLISHING IS A POLYMER, COPOLYMER, OR POLYMER BLEND COMPRISING AT LEAST ONE REPEATING GROUP COMPRISING AT LEAST ONE NITROGEN-CONTAINING HETEROCYCLIC RING OR A TERTIARY OR QUATERNARY NITROGEN ATOM. THE INVENTION FURTHER PROVIDES A CHEMICAL-MECHANICAL POLISHING COMPOSITION PARTICULARLY USEFUL IN POLISHING TUNGSTEN-CONTAINING SUBSTRATES.
申请公布号 MY137631(A) 申请公布日期 2009.02.27
申请号 MY2005PI02696 申请日期 2005.06.14
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 ROBERT VACASSY;DINESH N. KHANNA;ALEXANDER SIMPSON
分类号 C09G1/02;C09K3/14;C23F3/06;H01L21/321 主分类号 C09G1/02
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