| 摘要 |
THE INVENTION PROVIDES A CHEMICAL-MECHANICAL POLISHING PAD COMPRISING A POLISHING LAYER COMPRISING A HYDROPHOBIC REGION, A HYDROPHILIC REGION, AND AN ENDPOINT DETECTION PORT. THE HYDROPHOBIC REGION IS SUBSTANTIALLY ADJACENT TO THE ENDPOINT DETECTION PORT. THE HYDROPHOBIC REGION COMPRISES A POLYMERIC MATERIAL HAVING A SURFACE ENERGY OF 34 MN/M OR LESS AND A POLYMERIC MATERIAL HAVING A SURFACE ENERGY OF MORE THAN 34 MN/M. THE INVENTION FURTHER PROVIDES A METHOD OF POLISHING A SUBSTRATE COMPRISING THE USE OF THE POLISHING PAD.
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