| 摘要 |
A wiring board, a manufacturing method thereof and a semiconductor device having the wiring board are provided to reduce bent of wiring board without enlarging the size of the wiring board. A plurality of insulating layers(21,31) is stacked and includes a first insulating layer which is any one of a bottom layer or a top layer. Wiring patterns(25,26,28,29) are formed on the insulating layers. External connecting pads(33,37) are formed at the first insulating layer. An external connecting terminal(14) is installed at the external connecting pads. Molding resin(42) has an opening(41A) through which the external connecting pads are exposed. |
