SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor package and a manufacturing method thereof are provided to increase reliability about electric signal exchange by contacting a top semiconductor package with a bottom semiconductor package using a lead frame made of copper material. A semiconductor package includes a lead frame(300) made of copper material. The lead frame is separated to an independent terminal by grinding or sawing, and is mounted inside a first semiconductor package. A pad(306) of each lead(304) of the lead frame exposed outside is positioned on a top surface of the first semiconductor package. A second semiconductor package is laminated on the top surface of the lead frame.