ELECTRONIC COMPONENT PACKAGE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To propose a new package structure and a manufacturing method with respect to such a problem that package thinning and high reliability are not compatible with each other in an electronic component package with a hollow part formed and sealed on a functional element. SOLUTION: A resin layer provided with a space on a functional region and a metal layer are stacked. The metal layer is formed in such a manner that the same material is separated into a portion forming a lid having a projection for covering the space and supporting external pressure and a portion forming an external terminal. After plating the entire surface so as to fill the space part and the patterned upper resin layer that is provided on the lower-layer resin with a through hole formed, the same structure can be easily obtained by cutting into a predetermined thickness. COPYRIGHT: (C)2009,JPO&INPIT