| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate bonding apparatus capable of uniformly bonding the whole surfaces of substrates while preventing an air reservoir from occurring between the bonded substrates. <P>SOLUTION: The substrate bonding apparatus includes a first substrate holding means for holding a first substrate, a second substrate holding means for holding a second substrate, a pressing means for pressing a set of the first and second substrates via the first and second holding means, a control means for controlling pressing force of the pressing means and a position detecting means for detecting positions of the first and second substrates. At least one of surfaces of the first and second holding means for holding the substrate is formed to be convex. The control means controls, when bonding the first and second substrates, the pressing force based on a contact area calculated from substrate position information from the position detecting means, curvature of the convex and an elastic modulus of the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT |
