| 发明名称 |
VERFAHREN ZUM ABTRENNEN VON KOMPONENTEN VON EINEM SUBSTRAT |
| 摘要 |
<p>A substrate ( 1 ) having a first groove ( 4 ) is provided with a protrusion ( 3 ) on the first groove ( 4 ). This protrusion ( 4 ) preferably has a top with an apex angle of 30 to 150 degrees and results in a controlled breaking of the substrate ( 1 ) and a minimum of loss due to deviations of the crack initiated at the protrusion ( 4 ).</p> |
| 申请公布号 |
DE60230746(D1) |
申请公布日期 |
2009.02.26 |
| 申请号 |
DE2002630746 |
申请日期 |
2002.05.27 |
| 申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
BOUTEN, PETRUS C.;IN'T VELD, FREDERIK H.;WEHRENS, ROGER M. |
| 分类号 |
B28D5/00;C03B33/033;C03B33/07;C03B33/08;H01L21/78 |
主分类号 |
B28D5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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